Analysis
picoChip CEO appointed to the GSA EMEA Leadership Council
Guillaume d'Eyssautier, president and CEO, picoChip has been appointed to the newly named GSA EMEA Leadership Council. The Global Semiconductor Alliance (GSA) recently renamed from Fabless Semiconductor Association (FSA) and expanded its leadership council for Europe to be the EMEA (Europe, Middle East and Africa) Leadership Council, which reflects the multiple countries within EMEA that are playing a more significant and growing role within the industry.
“TThe EMEA Leadership Council will provide regional and global feedback to the organization’s Board of Directors by articulating regional challenges and identifying additional tools, resources and activities needed.
“The expansion of the EMEA Leadership Council demonstrates GSA’s continued commitment to global semiconductor companies,” said Jodi Shelton, GSA co-founder and executive director. “Regions face issues that are both similar to and unique from the semiconductor industry as a whole, and by working with GSA, Council members provide valuable insight and direction to help steer the GSA Board on matters related to EMEA.”
“I am honored to hold a position on the GSA EMEA Leadership Council. My wish is to lay particular focus on representing the next wave of semiconductor innovation,” said Guillaume d'Eyssautier, president and CEO, picoChip. “Young companies are often the ones who drive the new technologies, are out at the bleeding edge – and then grow dramatically. With this in mind I will represent that majority – the pre-IPO, venture-funded sector which is the future of our industry.”
GSA and IET, the Institute of Engineering and Technology, will host the fifth annual IET and GSA International Semiconductor Forum in May of 2008 in the United Kingdom. GSA also will host its first event in Israel, the GSA Israel Executive Forum in Tel Aviv in April of 2008.
picoChip is the leading supplier of multi-core DSP delivering extremely high performance at competitive cost points. It offers a powerful platform to develop products for emerging global wireless communications markets such as WiMAX, LTE, McWILL, TD-SCDMA and 4G.