ON Semiconductor awarded 'Trusted Design' DoD accreditation

The accreditation program is part of the DoD’s strategy to ensure that electronic components used in U.S. military and national security applications are trustworthy and secure. Certification is required and becoming more crucial as offshore migration of all sectors of the microelectronics industry increases and demand for high-performance ASICs from military and national security agencies continues to expand.

The new Trusted Design accreditation enables ON Semiconductor to own the process flow from design right through to wafer fabrication. The company’s  project engineering teams in Idaho can now focus on customer designs without third party intervention, accelerating design cycle times for complex ASICs and achieving valuable reductions in overall project costs. Under the Trusted Design accreditation, ON Semiconductor is able to support its 110 nanometer (nm), 180 nm, 0.35 um and 0.5 um standard cell digital designs at its Pocatello, Idaho, facility, which features 40,000 square feet of manufacturing clean room manufacturing space,  and at its Gresham, Oregon, facility that has more than 100,000 square feet of clean room space.

“Achieving Trusted Design accreditation underlines the extremely high quality and security of our technical expertise, facilities, processes and products,” said Vince Hopkin, vice president, Military/Aerospace, Digital, Custom Foundry, IPD and Image Sensor products at ON Semiconductor. “Along with the company’s previously awarded Trusted Foundry and Trusted Broker accreditations, the Trusted Design status enables ON Semiconductor to further improve our services to customers and achieve enhanced efficiencies that help reduce overall costs and time-to-market for new designs.”