Nihon Superior’s President Tetsuro Nishimura to Present at SMTA Pan Pacific Microelectronics Symposium 2012

The topic of the Symposium Keynote II will be “Pushing the Limits of Lead-Free Soldering,” in which Mr. Nishimura will discuss the wider issues involved in converting the global electronics industry to lead-free soldering technologies. During the presentation of the paper, titled “Tin-Copper-Nickel-Germanium – A Case Study in Lead-Free Implementation,” Mr. Nishimura will describe how he responded to the Japanese electronics industry’s need for a high-performance lead-free solder that was more cost-effective than the tin-silver-copper alloy that was then proposed as the only option.

Both presentations are based on Mr. Nishimura’s experiences in developing a lead-free solder that has earned widespread technical recognition and commercial success as well as establishing a Japanese company in the global market.