Analysis

New UV Cure Modular Flood Lamp Systems from Intertronics

7th October 2013
Jacqueline Regnier
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The new DYMAX ECE 2000 and ECE 5000 UV light curing modular flood lamp systems from Intertronics offer moderate to high-intensity curing over a 13cm x 13cm or 20cm x 20cm area for the fast curing of UV curable adhesives, coatings, and inks - also for curing parts with large bond lines or for simultaneously curing multiple parts in trays.  They offer a great solution for prototype or bench-top production in a wide variety of industrial applications including bonding, sealing, and encapsulating in the automotive, electronic, optical, and medical device assembly industries.

ECE 2000 and 5000 series flood lamp systems feature a power supply, reflector housing, and an industry standard 400 watt metal halide wide spectrum UV bulb suitable for all UV cure materials.  By adding modular accessories such as UV shielding, rapid operation shutter assemblies, and mounting stands, these flood lamps can be used as either turnkey bench-top systems or integrated into an automated assembly process. Modular ECE Series flood lamp systems are provided as complete packages ready to plug in and cure for a variety of production requirements. They are designed to optimize safety and convenience for process-controlled cures and may be configured with bulb options to deliver enhanced short-wavelength (UVB), long wave (UVA) or optimized visible (V) energy emissions.

The powerful ECE series UV flood lamp systems ensure fully cured products and fast cure times resulting in increased manufacturing yields with maximum safety and convenience for process-controlled cures.   ECE Series UV bulbs offer the industry’s most consistent intensity, with 2,000 hour warranty and offer the industry’s most consistent intensity over the 2,000 hour bulb warranty with or without shutters. For example in continuous use, bulb degradation of less than 20% over the first 2,000 hours is typical dependent upon on/off cycle’s temperature, humidity, and environment.

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