New online chip size estimator on show at EDS 2018

27th August 2018

Staff Reporter

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Swindon Silicon Systems, a Sensata Technologies company, will exhibit at EDS 2018 to be held at the Ricoh Arena, Coventry on October 17 and 18. At this year’s event, Swindon will give visitors the chance to try the company’s recently launched online chip size estimator. Called IC Builder it is a new way for designers to estimate the size of an ASIC solution designed specifically for their application and to informally discuss with Swindon what they need their ASIC to do.

Click by click, IC Builder allows the user to progressively add the functions required for their intelligent sensing application and the capability to see what the resulting package could look like.

Designers can add processors including ARM Cortex and Intel 8051, a choice of memory type – Flash, EEPROM, ADCs, DACs, low and band-pass filtering, sensors – including photodiode and temperature, frequency generators, RF and a choice of communication protocols. Designers can choose from several actuation device types including full bridge, gated drivers as well as low and high side drivers.

Power management by DC/DC converters or voltage regulators is selectable as is the type of protection required – such as EMC and surge and reverse polarity.

Finally, users can choose the operating voltage level for the device.

Once all the functions needed have been added, a single click will let the user see the package and its dimensions needed for their specific application.

Swindon’s Global Leadership

A global leader in the design and manufacture of ASICs and MEMS for automotive tyre pressure monitoring systems (the company supplies to more than 50% of the market), Swindon Silicon Systems is also a key supplier of single package devices to the medical and industrial sectors. The company’s devices can be found in hearing aids, sensor interfaces including proximity and positional, rotary and linear encoders and touch screen displays.

Swindon Silicon Systems team members will be on hand at EDS 2018 to discuss the advantages of single package devices for existing and emerging markets and provide an insight into the company’s full turnkey semiconductor service that delivers optimized solutions to provide customers with a technical and commercial competitive edge.