Analysis

MOSIS to unveil affordable access to 65nm wafer fab technologies at DATE 2007

6th March 2007
ES Admin
0
At the upcoming DATE 2007 show, MOSIS, the multi-project wafer (MPW) service provider, will introduce low cost access to the latest 65nm wafer fabrication technologies from IBM, including the foundry’s low power and RF technologies. The MOSIS service is based upon multiple integrated circuit designs sharing each mask set and wafer. Costs are shared between users of the service, based upon the silicon area that each design occupies. This makes even the most advanced technologies affordable for prototyping and low volume production, with costs just a small fraction of those that would be incurred through a dedicated wafer production run. The new IBM processes are ideal for high-speed, mixed-signal designs, particularly those aimed at wireless applications.
MOSIS offers access to a wide range of IC technologies from 1.5um down to the 65nm. Foundry services are provided in partnership with AMIS, Austria Microsystems, IBM and TSMC, with assembly handled by I2A.

Customers can chose between low cost, shared access MPW runs, yielding up to hundreds of samples, or dedicated mask and wafer runs where higher volumes are required. There are no die size constraints.

MOSIS is represented in Europe by EDA Solutions Ltd.

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