Analysis

Microsemi Announces Commercial Off-the-Shelf Up-Screening for Plastic Packaged Products

8th February 2011
ES Admin
0
Microsemi today announced it is offering commercial, off-the-shelf (COTS) up-screened plastic packaged products. The up-screening program is targeted at both commercial and defense system designs requiring higher levels of reliability assurance.
Up-screened products include MOSFETs, IGBTs and fast recovery diodes listed in the Power Products Catalog (http://www.microsemi.com/literature/PPGCAT.pdf). A standard up-screening flow has been created to assist customers in ordering these devices. All up-screened devices will be ordered using a MXL suffix. Variations to the standard flow are also possible with Microsemi's standard custom process.

Standard up-screening stresses include:

· High Temperature Bake
· Temperature Cycle
· High Temperature Gate Bias (HTGB)
· High Temperature Reverse Bias (HTRB)
· Post Stress Electrical Testing

Many companies today are pursuing the use of plastic devices versus their hermetic counterparts in high reliability applications where keeping costs down is key, said Russell Crecraft, Vice President and General Manager for Microsemi's Power Products Group. This product offering complements Microsemi's existing hermetic offerings and plastic up-screened products.

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