Intersil's Logic level translators deliver dynamic voltage shifting in mixed supply systems

The VLTs are ideal for 3.3V SD, mini SD, memory stick and multimedia card applications that require I/O signal translation to the industry’s latest low-voltage system controllers. The ISL3036E delivers the same industry-leading performance in a four-channel configuration.

With IEC61000-4-2 +/-15kV air gap, +/-9kV contact, and +/-15kV HBM protection on all input, output and I/O lines, the translators provide the industry’s best ESD protection. This is especially important in SD memory card applications, where the translator resides at the edge of the connector and can be vulnerable to ESD events.

The ISL3034E/35E/36E series features auto-direction sensing, eliminating the need for direction control logic pins and associated software control, making them excellent design choices for memory-card level translation or for general-purpose applications. In addition the auto-direction sensing function allows bit-by-bit determination of signal flow.

The VLTs operate with VCC (SD card supply) voltages from +2.2V to +3.6V and VL voltages from +1.35V to +3.2V, enabling data transfer between low-voltage MCUs or ASICs and higher voltage components, such as SD cards. These power supply ranges allow level shifting between 1.5V, 1.8V, and 2.5V powered devices on the VL (system controller supply side) and 2.5V and 3.3V devices on the VCC side.

Each I/O channel is pulled up to VCC or VL by an internal 30uA current source, allowing the VLTs to be driven by either push-pull or open-drain drivers.

The ISL3034E and ISL3036E also have an enable (EN) input that places the IC into a low-power shutdown mode when the input is driven low. All versions feature an automatic shutdown mode that places the part in the same low power state when VCC is less than VL.

The ISL3035E features a clock return output that returns the same signal applied to the clock VL input, but with a delay that better mimics the timing of data read back from a memory card.

Each is now available in tiny 2.6mm x 1.8mm 16 leadless uTQFN packages, which are superior to chip scale packages because they do not crack or break under stress, and have improved pin access for easier debug and rework access.