Learn About STI Electronics’ Engineering Services at the 2011 National SBIR Beyond Phase II Conference & Technology Showcase

STI’s Engineering Services division will feature its custom manufacturing for the defense sector, as well as counterfeit detection. Additionally, the microelectronics lab specializes in state-of-the-art engineering design and assembly including current technologies such as Chip-On-Board (COB) and Multichip Module (MCM) as well as emerging technologies such as STI’s patented packaging technology coined Imbedded Component/Die Technology (IC/DT®) which also will be featured.

STI’s Engineering Services division is a multifaceted technical organization whose common goal is to provide engineering support in the field of electronics manufacturing. From product design and manufacturability analysis to pre-production prototype and development, STI’s Prototype and Development Lab is a full service design review and pre-production facility.