Analysis
Launch of PARSIMO - €4.9 million System-In-Package European Project
Silvaco Europe Ltd., and its partners have been awarded a €4.9 million project to develop advanced software modelling methods. This will lead to improved design efficiency of the complex semiconductor components needed in critical applications. Use of high levels of integration in heterogeneous system-in-package (SiP) circuit designs results in smaller, smarter and more energy efficient products for aerospace, automotive, healthcare and consumer electronics.
The PARSIMO will investigate modelling methods to improve the predictive accuracy for SiP design, while reducing simulation time to optimise cost and performance using new partitioning methods. By cutting manufacturing costs, SiP solutions will be attainable for small and medium-sized enterprises (SMEs) - a key sector in European economic recovery.
The ENIAC JU project has brought together leading European specialist engineers to speed design and automate production of new advanced heterogeneous components.
“The main goal of PARSIMO is to organise tools and methodologies to improve design efficiency for complex components needed in critical applications”, said Dr Ahmed Nejim of Silvaco Europe. “The multi-disciplinary approach brings together a highly specialised team capable of significant strides in this important area.”
“System-in-Package design is an enabler of new and pervasive applications incorporating mixed-signal systems, sensors and wireless devices in 3D. PARSIMO provides an opportunity for leading European specialists to speed up design using off-the-shelf components and make such technologies accessible, particularly to SMEs”, said Professor Merlyne De Souza of Sheffield University who is also coordinator of the project.