Laird Technologies to Attend electronica 2010

Each booth at the tradeshow will highlight different portions of Laird Technologies’ portfolio. Hall A2, booth #171 will feature products and capabilities from the EMI, Signal Integrity, Specialty Metal, and Thermal Management product lines. World-class technicians will be on-hand to assist all visitors and answer questions regarding the vast capabilities the company offers, especially regarding the creation of customized solutions that can be designed specifically for any product. Attendees will also be able to browse the LairdTech.com Website at one of two self-serve kiosks and enjoy multi-media presentations featuring Laird Technologies’ global corporation.

The same high-level expertise will be available in Hall A4, booth #W15-W16, where the focus will be on the Infrastructure Antenna Systems and Telematics & Wireless M2M product lines. The experts at this location will also highlight the company’s capabilities and product offerings as well have demonstrations available, showcasing product application.

The press conference will highlight new products, current products, technology trends, and the company’s presence in the electronics industry. New products to be announced by Laird Technologies at electronica 2010 include board-level shielding (BLS), fingerstock, electrically conductive elastomers (ECEs), Fabric-over-Foam (FoF), thermal interface materials (TIMs), and infrastructure antennas. Company representatives and technologists will be available at the session to answer any questions.