Analysis

Laird Technologies Publishes Thermoelectric Assembly Handbook

1st December 2010
ES Admin
0
Laird Technologies, Inc., a global leader in the design and manufacture of customized, performance-critical components for wireless systems and other advanced electronics applications, today announced the publication of its “Thermoelectric Assembly Handbook”.
The handbook was composed by Laird Technologies’ thermoelectric subject matter experts, and focuses on the structure and function of Thermoelectric Assemblies (TEAs). It provides in-depth insight into understanding heat transfer configurations, primary attributes required for device selection, and guidelines for installation and operational use in order to maximize service life.

“The Thermoelectric Assembly Handbook is a valuable tool that every thermal engineer should reference when specifying a Thermoelectric Assembly for their application,” said Andrew Dereka, Laird Technologies Thermoelectrics Product Manager. “This is a comprehensive tutorial that educates readers on product selection, installation, and operational guidelines that directly results in faster product development cycles and increased efficiency of the TEAs specified in the designer’s application.”

Designed for engineers with novice to intermediate thermoelectric experience, the Thermoelectric Assembly Handbook discusses Laird Technologies’ TEA product portfolio, heat exchanger mechanisms, thermal modeling, operational limitations, installation guidelines, and selection for a closed loop feedback control system that drives a TEA to a specific temperature set point or Proportional Integral Derivative (PID) algorithm.

As an industry leader in high-performance and cost-effective Thermal Management Solutions, Laird Technologies provides the knowledge, innovation, and resources to ensure exceptional thermal performance and customer satisfaction for applications in the medical, analytical, telecom, industrial, and consumer markets.

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