Laird Technologies to Present at SPIE Photonics West 2013

Dr. Hershberger’s paper, “Efficient Thermoelectric Cooling of Concentrated Heat Loads” covers the improved efficiency of thermoelectric coolers based on thermally conductive printed circuit boards when cooling concentrated heat loads. He will be on hand to discuss data results from testing the efficiency of TCPCB-based TECs compared to more traditional TECs with aluminium oxide printed circuit boards.

During the exhibition, Laird Technologies will showcase a variety of Thermal Management Solutions including the eTEC Series, UltraTEC Series and OptoTEC Series thermoelectric modules, WL Series liquid exchanger systems, as well as the Tunnel Series and PowerCool Series thermoelectric assemblies. In addition to its own products, Laird Technologies has partnered with Nextreme Thermal Solutions, which will be exhibiting its thin film thermoelectric technology at the same booth. As part of the Laird Performance Materials division, these products focus on providing vital protection to a wide range of devices.

“Temperature stabilization of high powered laser devices is crucial to maintaining peak performance,” said Andrew Dereka, Laird Technologies Product Manager. “Laird Technologies provides a wide product breadth of thermal management solutions from thermal interface materials, thermoelectric modules to liquid cooling systems to address these complex heat load challenges.”

SPIE Photonics West 2013 is the premier photonics and laser event covering biophotonics and biomedical optics, high-power laser manufacturing, optoelectronics, microfabrication and green photonics. During the exhibition, more than 1,200 companies will attend to see the latest products, tools, applications and to visit over 1,300 suppliers.