Analysis
Teledyne LeCroy Showcases Latest Innovations At DesignCon 2013
Teledyne LeCroy will be showcasing the latest innovations in signal integrity test and measurement at the DesignCon 2013 exhibition in Santa Clara. Show attendees can join Teledyne LeCroy for product demonstrations at the expo, in-depth technical presentations by the R&D engineers, seminars on applications, and discussions with the engineers on the exhibition floor at booth 209.
ProdA longtime Diamond Sponsor of DesignCon, Teledyne LeCroy is also a significant contributor to the technical conference with nine technical presentations, panels and seminars by Teledyne LeCroy engineers and experts. Highlights of the presentations include a fast and inexpensive method for PCB trace characterization in production environments, and understanding apparent increasing random jitter with increasing PRBS test pattern lengths.
Product demonstrations include:
1) LabMaster 10 Zi modular oscilloscope with up to 80 channels at 36 GHz, and up to 40 channels at 65 GHz;
2) SDAIII-CompleteLinQ serial data analysis package that simultaneously performs eye, jitter, vertical noise, and crosstalk analysis on up to four lanes simultaneously;
3) SPARQ, 2 to 12 port signal integrity network analyzers;
4) HDO, the industry's first 12-bit high definition oscilloscope;
5) PCI Express 3.0 transmit, receive, and link equalization testing;
6) 14.1 Gb/s Serial Trigger Option for WaveMaster 8 Zi-A and LabMaster 9 Zi-A/10Zi oscilloscopes;
7) PCI Express Dynamic Equalization Test Arcs;
8) Largest selection of protocol solutions with multi protocol analysis and cross synchronization;
9) DDR, LPDDR, SAS, SATA, PCI Express, USB, DisplayPort Compliance Solutions.