Kyzen to Display MICRONOX® MX2302 Wafer-Level Cleaning Solution at IMAPS 2011 – Long Beach

MICRONOX® MX2302 is an engineered semi-aqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux from wafer bumps found in flip chip, chip scale and μBGA packages.

MX2302 has proven effective in ultrasonic, centrifugal and semi-aqueous spray under immersion cleaning systems. Easy to use, MX2302 has excellent compatibility with all soldering materials, passivation layers (PI, Nitride, Silicon Dioxide, BCB, etc.) and metal layers.

MICRONOX® MX2302 is available in one, five, and 55 gallon containers.

Kyzen® and MICRONOX® are registered trademarks in the United States and other countries.