Kyzen Technology Experts to Present at SMTA Penang 2012

Mr. TC Loy will present the paper “Flip Chip Cleaning Process Considerations.” With flip chip I/O (number of bumps under the die) increasing, reliability concerns move design engineers to study the beneficial properties of removing flux residue before underfill. Cleaning flux residue under flip chip die requires advanced process design considerations in the form of mechanical impingement and the cleaning fluid. Improved mechanical designs and the introduction of water soluble flux allows processes that use DI-water only as the cleaning fluid. The problem is that as flip chip I/O increases, assemblers report that DI-water only will not adequately clean certain package designs. This paper introduces an engineered cleaning solution with a low surface tension. Low surface tension solutions improve wetting, penetration and cleaning of flux residue under flip chip assemblies. The advanced cleaning fluid referenced in this paper improves flip chip reliability and yield.

Ms. Lily d/o Sanarajoo will present the paper “Understencil Wiping: Does It Benefit Your Process?” Understencil wiping has gained interest over the last several years. Changes in circuit designs, such as miniaturized components, increased density of components and new stencil technology, as well as changes in and increased attention to employee safety and environmental regulations have driven renewed interest. New understencil wipe solvents have been introduced recently to address these issues. However, little to no quantitative data exists on how these new solvents benefit the printing process, specifically, yields, transfer efficiencies and print volume repeatability. The lack of data has led to slow adoption of understencil wipe cleaning solvents, as there is no proof that the costs justify their benefits. This paper quantitatively examines the effect of various combinations of solvents, wiping frequency and pastes in a way that is relevant to both process engineers and the bottom