Kontron defines new Computer-on-Module standard creating low-power, scalable, out-of-the-box solutions

The standard at a glance
The new COM standard was developed to encompass a new range of modules for ARM and SOC processors. Based on the 314-pin MXM 3.0 connector that is only 4.3mm in height, it enables durable and slim designs with a cost-efficient horizontal card edge / goldfinger connection. The connector is also available in a shock and vibration proof construction suitable for harsh environments. The standard enables new interfaces specifically for the new ARM and SOC platforms including video outputs such as LVDS. Looking down the road, the standard will also allow for the use of DisplayPort 24-bit RGB and HDMI. Another first are the dedicated camera interfaces, which are included in the standard, minimizing design efforts and BOM. As a result, users no longer need to compromise or work with inefficient standards that are stretched between the x86 feature set and lean ARM and SOC I/Os. Initially covered under the standard are two module footprints to offer flexibility for different mechanical requirements: a short module measuring 82 mm x 50 mm and a full size module measuring 82 mm x 80 mm. Other sections of the standard address the already familiar requirements of other module standards, resulting in the latest 1.0 version achieving a high-degree of maturity. More details are available under NDA.

Our strategic entry and massive investment is spearheaded not only by upcoming product launches, but moreover by a new Computer-on-Modules form factor standard for these new products. This emphasizes our commitment to the standardization of scalable technologies right from the onset, Dirk Finstel, CTO of Kontron explained. We have been very successful with embedded form factor standardization and particularly with ETX and COM Express standards. Now we have begun to mirror this success story in the ARM and SOC market segment, which complements that of x86 technology. Compared to the current ARM and SOC approach, which is characterized by full custom designs alone, customers benefit from the new massively reduced R&D investment costs, by utilizing application ready platform solutions, that have not been available in their sectors prior to this standard. And we are very happy to have ADLINK on board to support this standard. This will accelerate its success.

We are proud to be the first company to support the new low-power embedded architecture platform, Henk van Bremen, Product Director for Embedded Computing at ADLINK Technology added. It is an honor and very exciting to be able to enter the previously proprietary ARM market with a standardization initiative for COTS products. This is ideal for custom specific designs based on a proven and scalable module platform and will save customers significant time and cost. The proof of concept will be validated extremely quickly by OEM implementations. And those implementations are expected to arrive in sufficient volumes to create a defacto standard. This will be very beneficial to all technology followers due to availability and cost effectiveness being guaranteed from the start.