KIC’s Sales and Service Engineer to Present at the SMTA Technical Forum in Guadalajara

KIC will present three examples of reflow related defects (bridging, tombstoning and solder balling), and how they are easily and efficiently solved as per a solder paste manufacturer’s recommendations. KIC explains how to easily identify with a profile if the defect is reflow-related.

A Defect Mitigation Guide will be provided, covering eight common reflow-related defects. KIC also will discuss how to avoid or prevent process-related defects from occurring, both for the reflow oven and the wave soldering process. For example, the importance of developing a deep in specification thermal process will be explained, in addition to which thermal profiling tooling and software can be used to achieve excellent defect free results.

Mr. Lopez is a Sales and Service Engineer for Mexico with KIC. He has been active in the Mexico marketplace for 15 years with a focus on reflow and wave soldering processes.