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Group publishes Board Mounted Power Supply Application Guidelines

28th March 2007

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The High Density Packaging (HDP) User Group announces the launch of the industry's first Board Mounted Power Supply (BMPS) Application Guidelines. The 148-page document is designed to support the communications and electronics manufacturing industry by promoting understanding of BMPS products. Originally started as a project within the Power Sources Manufacturers Association (PSMA) in 2002, the activity was incorporated into an HDP User Group Project in 2005. Since then major users and manufacturers of BMPS products, have worked to define the market¹s requirements with respect to such products and to communicate manufacturers¹ capabilities for meeting these requirements. The BMPS Application Guidelines document is the result of their efforts.

Contributors to the document include Alcatel-Lucent, Ericsson, International Rectifier, NetPower Technologies, TDK Innoveta, Siemens Networks and Tyco Electronics. The document is endorsed by users and systems integrators including Alcatel-Lucent, Ericsson, Intel Corporation, Juniper Networks,
Siemens Networks, and supported by the Power Sources Manufacturers Association (PSMA), the European Power Supply Manufacturers Association (EPSMA), Artesyn Technologies (Emerson), and TI (PowerTrends).

The introduction of the BMPS Application Guidelines will help our member companies to communicate, for example, reliability requirements and various impacts of design decisions. It will also help designers and users of board mounted power supplies to better understand and use these products,² says
Marshall Andrews Executive Director of the HDP User Group.

We're happy to see this project, originated by the PSMA, come to a successful conclusion and we're eager to see it being adopted by the industry. says Bruce Miller PSMA Chairman.