Analysis
Gate drive optocoupler provides 50% space saving in applications requiring reinforced insulation to international safety standards
Toshiba Electronics Europe (TEE) has launched a miniature photocoupler that delivers the same isolation and current outputs as previous DIP packaged devices in a form factor that is 50% smaller. The new TLP700 is ideal for saving space in applications that require the reinforced isolation demanded for international safety certification.
The Operating with a supply voltage of between 15V and 30V, the TLP700 keeps power consumption to a minimum through a maximum supply current of just 2mA. Maximum switching time is rated at 500ns.
The new photocoupler comprises a GaAlAs infrared LED and a photodetector IC in the latest SDIP six-pin packaging measuring just 6.8mm x 4.58mm x 3.65mm. The device has been designed to meet the requirements of all relevant international safety approvals and delivers guaranteed performance at temperatures between -40°C and 100°C.