Preview for the 2011 SMTA International Electronics Exhibition, booth # 403

The new release of Seica’s top and bottom laser selective soldering systems provides the flexibility that customers want. We have expanded the success of our single laser Firefly system to now include the ability to solder from both the top and bottom simultaneously.

The Firefly line is created and designed to optimize adaptability and automation in the soldering process. Specific requirements can be met with the solutions offered by the Firefly systems, such as external pre-heating unit, full control by the system software, and internal hot air nozzles on both sides of the boards. Top or bottom side soldering configurations are available to satisfy the different manufacturing needs of customers.

Supplying energy through a laser source allows point to point adjustment of the power needed for soldering. The ability to apply all of the energy in a single point makes this technology applicable in situations where it is not possible to heat the whole board or where problems are generated by reduced accessibility. The solder can quickly and easily be changed from lead to lead-free solder, as it is a simple matter of changing the spool. The soldering process is clean; it also eliminates the costs and logistics of having to use Nitrogen.

The VIVA Integrated Platform automatically acquires the points to be soldered through more than 40 CAD data import tools and/or through the integrated vision system, which enables the visual acquisition of the points to be soldered if CAD data is not available.