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Technologically leading Test and Measurement Solutions at electronica 2012

30th October 2012

ES Admin

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At this year’s electronica trade show in Munich/Germany GOEPEL will introduce awarded as well as worldwide unrivalled and new solutions in electric and optical test and measurement technologies. In hall A1, stand 351 interested parties are welcome to learn about the versatile opportunities to support various test methods such as JTAG/Boundary Scan, Automated Optical Inspection (AOI), Automated X-Ray Inspection (AXI) and solder paste inspection (SPI).

Furthermore, show visitors may have a closer look at diverse combination and integration opportunities of different test technologies to increase fault coverage and close test gaps. As globally unique company, GOEPEL electronic provides various test methods and their combinations as one-stop-shop.

Most spectacular highlights in the field of JTAG/Boundary Scan are the worldwide first WLAN Boundary Scan Controller as well as the newest member in the inline programmer system series RAPIDO. RPS3000 is the first inline multi-site system for test and programming based on “Embedded System Access” technologies. The system’s modular architecture allows for double-sided assembly contacting at enormous programming speed.

Under the term “Embedded System Access” (ESA) GOEPEL electronic additionally provides a multitude of innovative technologies to support access to components and assemblies for test, programming, validation or emulation tasks. This is a completely new class of methods for JTAG/Boundary Scan, Chip embedded Instruments, in-system programming or Processor Emulation Tests, to name of few.

The world of Automated Optical Inspection (AOI) will be getting richer by several innovations. The multiple award-winning AOI system OptiCon THT-Line will be available with integrated double-sided solder joint inspection from autumn 2012 on. Now PCB top and bottom sides can be inspected in one system.

GOEPEL electronic‘s AOI software OptiCon PILOT version 5.3 will be presented with new functions to increase test depth and reduce time efforts for test program generation. A special feature is the new statistics module with extensive opportunities for fault display and evaluation.

In addition to the new AOI option in the OptiCon X-Line 3D AXI system, the opportunity to inspect “Package-on-Package” assemblies will be introduced at stand A1, 351. Visitors may also inform practically about the currently highest inspection speed worldwide an AXI system provides.