Analysis

Deadline extended for technical conference paper abstracts

30th June 2016
IPC
Daisy Stapley-Bunten
0

The deadline of the invitation for engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2017 to be held at the San Diego Convention Center has been extended by IPC. Professional development courses will take place 12th, 13th, and 16th Februar, 2017 and the technical conference will take place 14th-16th February, 2017. The extended deadline is 8th July, 2016.

The industry’s premier conference and exhibition for the electronic interconnection industry, IPC APEX EXPO provides presenters and their companies with a notable and cost-effective opportunity to promote their expertise and gain visibility with key engineers, managers and executives from all segments of the industry worldwide. Staff from companies such as Nokia, Ericsson, Indium, Flextronics, Intel and MacDermid have presented papers at past technical conference sessions at IPC APEX EXPO. To recognise exceptional achievement, awards will be presented for ‘Best Paper’.

Expert papers and presentations are being sought on design, materials, assembly, processes, test, reliability and equipment in the following areas:

  • 3D Printing in Electronics Manufacturing
  • Automation in Electronics Manufacturing
  • Adhesives
  • Advanced Technology
  • Area Array/Flip Chip/0201 Metric
  • Assembly and Rework Processes
  • BGA/CSP Packaging
  • Black Pad and Other Board Related Defect Issues
  • BTC/QFN/LGA Components
  • Business & Supply Chain Issues
  • Cleaning
  • Conformal Coatings
  • Corrosion
  • Counterfeit Electronics
  • Design
  • Electromigration
  • Electronics Manufacturing Services • Embedded Passive & Active Devices
  • Environmental Compliance
  • Graphene in Electronics Manufacturing
  • Lean Six Sigma
  • LED Manufacturing
  • Failure Analysis
  • Flexible Circuitry
  • HDI Technologies
  • Head-on-Pillow
  • Board and Component Warpage
  • High Speed, High Frequency & Signal 
  • Industry 4.0
  • Integrity
  • Lead-Free Fabrication, Assembly & Reliability
  • Miniaturisation Nanotechnology Optoelectronics
  • Packaging & Components • PCB Fabrication
  • PCB and Component Storage & Handling Performance
  • Quality & Reliability
  • Photovoltaics
  • PoP (Package-on-Package)
  • Printed Electronics
  • Reshoring
  • RFID Circuitry
  • Robotics
  • Soldering
  • Surface Finishes
  • Test, Inspection & AOI
  • Tin Whiskers
  • 2.5-D/3-D Component Packaging
  • Underfills
  • Via Plugging & Other Protection
  • Wearables

A 200-400 word technical conference abstract summarising original and previously unpublished work covering case histories, research and discoveries must be submitted. The submission should describe significant results from experiments and case studies, emphasise new techniques, discuss trends of interest and contain appropriate technical test results. In addition, course proposals are solicited from individuals interested in presenting half-day or full-day professional development courses on design, lead-free technologies, manufacturing processes, process improvement, materials, test and reliability.

Technical conference paper abstracts are due 8th July, 2016 and course proposals are due 5th August, 2016. To submit an abstract or course proposal, visit the IPC APEX EXPO website.

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