Companies collaborate to develop technology based on GaN

The first area in which the companies are collaborating is communications and computing infrastructure, GaN’s low capacitance and zero Q_RR coupled with the low inductance of its chip-scale package result in high efficiency at high frequency. This increase in efficiency will combine with IDT’s precise commutation and system expertise to drive up power density and deliver significant competitive advantage to communications and computing infrastructures.

The second area is wireless power, the highly resonant wireless power transfer standard of the Alliance for Wireless Power consortium protocol operates at 6.78MHz, where the high speed, low-loss switching ability of GaN drives efficiency to the levels of wired solutions. Combining the GaN expertise of EPC and precision solutions of IDT will deliver a highly efficient, cost competitive solution that will drive widespread adoption of wireless power.

The last area is RF, where the two companies will explore collaboration to create a portfolio of RF products for the communications infrastructure market.