Chomerics to showcase latest thermal and shielding product innovations at Electronica 2010

As electronics technology has evolved, specialists such as Chomerics have developed materials to meet the new challenges including those caused by smaller form factors, closer proximity of analogue and power components to sensitive integrated circuits, and the difficulties of shielding the growing number of battery powered portable products from spurious EMI.

New materials that visitors to the Chomerics booth at Electronica can see and discuss with experts include the company’s THERM-A-GAPTM T652 thermally conductive dispensable gap filler that combines compliance under low assembly pressures with thermal performance of 3W/m-k and an operating temperature range of -50ºC to +150ºC, and EMI shielding materials that use low transfer impedance Nickel / aluminium (Ni/Al) particle filled elastomers to give industry-leading levels of shielding effectiveness.