Alpha's Alan Plant to Present at Tallin Reliability Summit

Plant’s presentation, The effect of mixing BGA and solder paste alloys on the formation of voids, highlights a potential problem arising when assemblies are produced using spheres and solder pastes with different alloy compositions.

Hugely experienced, Plant has been an invaluable member of the Alpha team for the past 7 years. A metallurgist by training, he has been involved in electronics assembly for some 27 years overall, having held several positions within ICL and Celestica before his time with Alpha.

The European Electronics Assembly Reliability and Yield Enhancement Summit brings together experts and provides an opportunity to examine, learn and debate these business-critical issues and a forum for industry discussion, technical collaboration and information sharing.

Alpha, a Cookson Electronics company, is the global leader in the development, manufacturing and sales of innovative materials used in electronic assembly processes. With a unique worldwide presence in 50 locations throughout the Americas, Europe and the Asia/Pacific region, Alpha supplies a full line of Solder Paste, Stencils, Squeegee Blades, Stencil & PCB Cleaners, Bar Solder, Cored Wire Solder, Wave Soldering Fluxes, and SMD Adhesives. Cookson Electronics Semiconductor Packaging is the leader in EMC and polymeric materials for semiconductor packaging. Alpha also offers product technologies for the Photovoltaic market to help lower production costs and increase throughput and yield. Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality soldering materials. That tradition continues today through its innovative products, including its line of environmentally friendly, lead-free electronic assembly products.