Analysis

3.2-megapixel and 2.0-megapixel CMOS image sensors

17th October 2006
ES Admin
0
Toshiba Electronics Europe has announced the further expansion of its Dynastron CMOS image sensor product line with the addition of two new devices: the 3.2-megapixel ET8EE6-AS CMOS image sensor and 2.0-megapixel ET8EF2-AS CMOS image sensor SoC with integrated image-signal processor (ISP).
With a pixel pitch of just 2.2 microns, a significant advance in cell-size miniaturisation compared to the 2.7-micron pixel pitch of previous 2- and 3.2-megapixel products, the new devices enable development of smaller, space-saving camera modules for cellular phones and other camera-enabled mobile devices.

Toshiba engineers were able to reduce the pixel pitch in both image sensors from 2.7 microns to 2.2 microns while retaining a pixel size capable of recording high-resolution images. With the ET8EE6-AS, Toshiba reduced a 3.2-megapixel image sensor to a 1/3.2 optical format, an improvement over the company’s previous 1/2.6-inch format size. ET8EF2-AS achieves a 2.0-megapixel count in a 1/4-inch optical format.

The new sensors also offer low-power consumption, smearless imaging and high-speed operation, all essential requirements for personal mobile equipment, including camera phones and personal media centres. (A smear is a vertical stripe in an image and can occur in bright-light conditions, such as direct sunlight.). The ET8EF2-AS also integrates an ISP for sophisticated picture effects and advanced camera operations, such as digital zoom, windowing, image downsizing and picture flip.



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