Design
Sphere Entertainment acquires HOLOPLOT
Sphere Entertainment announces that it has acquired all of the remaining shares it did not previously own of HOLOPLOT, a global pioneer in 3D audio technology.
Printed electronics in electrified and autonomous mobility
Electrification, autonomy, and vehicle ownership saturation are causing a technological revolution in the automotive sector.
Students challenged to design nuclear fission and fusion decommissioning robots
Students in West Cumbria have been tasked by the Robotics and AI Collaboration (RAICo) and the Industrial Solutions Hub (iSH) to design and build robots which will be showcased at a major robotics and artificial intelligence (RAI) industry event.
Professor resolves two decades of oxide semiconductor challenges
In a significant stride for semiconductor technology, a team led by Professor Yong-Young Noh from the Department of Chemical Engineering at Pohang University of Science and Technology (POSTECH) has developed a new tellurium-selenium composite oxide semiconductor material.
SHENMAO’s ultra-low void paste
SHENMAO Technology is pleased to offer its PF606-P276 ultra-low void no-clean zero-halogen lead-free solder paste.
Trends and challenges in the era of wide bandgap semiconductors for power electronics
Keysight recently held a webinar titled: “Overcoming Design Challenges in the Era of Wide Bandgap Semiconductors,” in which valuable insights on the trends and challenges of power electronics were explored.
Creo 11 launch set to help engineers deliver better designs in less time
PTC has unveiled the eleventh iteration of its Creo computer-aided design (CAD) software, along with the most recent update to its Creo+ SaaS CAD solution.
MathWorks MATLAB available in NVIDIA Holoscan
MathWorks has announced an integration that makes MATLAB available in the NVIDIA Holoscan platform.
Integrating AI into aircraft design: opportunities and challenges
The integration of artificial intelligence (AI) into aircraft design represents a transformative shift within the aerospace industry.
Synopsys and Samsung Electronics collaborate for flagship mobile CPU
Synopsys has announced that Samsung Electronics has achieved successful production tapeout for its high-performance mobile SoC design, including flagship CPUs and GPUs, with 300MHz higher performance using Synopsys.ai full stack AI-driven EDA suite and a broad portfolio of Synopsys IP on Samsung Foundry's latest Gate-All-Around (GAA) process technologies.